Conductive bridge memory system and method of manufacture thereof

ABSTRACT

A conductive bridge memory system and method of manufacture thereof including: providing a dielectric layer having a hole on a bottom electrode, the hole over the bottom electrode; forming an ionic source layer in the hole and over the bottom electrode including: depositing a reactivation layer over the bottom electrode, depositing a first ion source layer on the reactivation layer, depositing another of the reactivation layer on the first ion source layer, depositing a second ion source layer on the another of the reactivation layer; and forming an upper electrode on the ionic source layer.

TECHNICAL FIELD

The present invention relates generally to a semiconductor memorysystem, and more particularly to a random access memory system.

BACKGROUND ART

The performance of non-volatile memory systems has improved over thepast several years. Changes in technology management have pushed thenon-volatile memory devices into cameras, computers, personal dataassistants, smart phones, and proprietary business applications.

The current flash memory devices, based on charge storage technologies,have limited life spans due to damage of the charge storage layersduring writes. The damage can be caused by physical weakening of thecrystal structure used to store the charge. This condition is counteredby limiting the number of writes and reads that an individual memorycell can undergo and balancing writes across all of the locations in thememory. The limited reliability of the cells has given rise to errorcorrection strategies and distributed write operations in order toextend the useable life of the memory modules. Many maintenanceprocesses can operate in background without the knowledge of theoperator.

Other non-volatile memory technologies are in development that canincrease the useable memory density while extending the lifetimereliability of the memory structures. These non-volatile memorytechnologies include spin transfer torque random access memory(STT-RAM), resistive random access memory, and programmablemetallization memory.

Programmable metallization memories are also referred to as conductivebridge random access memory (CBRAM), each cell of which generallyconsists of an ionic source layer and an oxide film sandwiched between abottom electrode and an upper electrode. Memory cell operation is due toformation/dissolution of a conductive bridge formed byelectro-deposition of materials from the ionic source layer. In acurrent known fabrication method for CBRAM cells, layers are depositedby a physical vapor deposition (PVD) process. However, removal ofsputter deposited materials from unwanted areas may leave residues whichcan damage cell performance. Further, PVD cannot be used in a damasceneprocess to form confined memory cells.

Thus, a need still remains for a better conductive bridge memory systemand method of manufacture thereof. In view of the push to ever-smallerdevices and higher density memory, it is increasingly critical thatanswers be found to these problems. In view of the ever-increasingcommercial competitive pressures, along with growing consumerexpectations and the diminishing opportunities for meaningful productdifferentiation in the marketplace, it is critical that answers be foundfor these problems. Additionally, the need to reduce costs, improveefficiencies and performance, and meet competitive pressures adds aneven greater urgency to the critical necessity for finding answers tothese problems.

Solutions to these problems have been long sought but prior developmentshave not taught or suggested any solutions and, thus, solutions to theseproblems have long eluded those skilled in the art.

DISCLOSURE OF THE INVENTION

The present invention provides a method of manufacture of a conductivebridge memory system including: providing a dielectric layer having ahole on a bottom electrode, the hole over the bottom electrode; formingan ionic source layer in the hole and over the bottom electrodeincluding: depositing a reactivation layer over the bottom electrode,depositing a first ion source layer on the reactivation layer,depositing another of the reactivation layer on the first ion sourcelayer, depositing a second ion source layer on the another of thereactivation layer; and forming an upper electrode on the ionic sourcelayer.

The present invention provides a conductive bridge memory system,including: a bottom electrode; a dielectric layer having a hole over thebottom electrode; an ionic source layer in the hole and over the bottomelectrode, the ionic source layer including: a reactivation layer overthe bottom electrode, a first ion source layer on the reactivationlayer, another of the reactivation layer on the first ion source layer,a second ion source layer on the another of the reactivation layer; andan upper electrode on the ionic source layer.

Certain embodiments of the invention have other steps or elements inaddition to or in place of those mentioned above. The steps or elementwill become apparent to those skilled in the art from a reading of thefollowing detailed description when taken with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an architectural diagram of a conductive bridge memory systemin an embodiment of the present invention.

FIG. 2 is a detailed view of a portion of the memory layer.

FIG. 3 is a cross-sectional view of the portion of the memory layer in adeposition phase of manufacture.

FIG. 4 is the structure of FIG. 3 in a further deposition phase ofmanufacture.

FIG. 5 is the structure of FIG. 4 in a further deposition phase ofmanufacture.

FIG. 6 is a flow chart of a method of manufacture of a conductive bridgememory system in a further embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

The following embodiments are described in sufficient detail to enablethose skilled in the art to make and use the invention. It is to beunderstood that other embodiments would be evident based on the presentdisclosure, and that system, process, or mechanical changes may be madewithout departing from the scope of the present invention.

In the following description, numerous specific details are given toprovide a thorough understanding of the invention. However, it will beapparent that the invention may be practiced without these specificdetails. In order to avoid obscuring the present invention, somewell-known circuits, system configurations, and process steps are notdisclosed in detail.

The drawings showing embodiments of the system are semi-diagrammatic andnot to scale and, particularly, some of the dimensions are for theclarity of presentation and are shown exaggerated in the drawing FIGs.Similarly, although the views in the drawings for ease of descriptiongenerally show similar orientations, this depiction in the FIGs. isarbitrary for the most part. Generally, the invention can be operated inany orientation.

The same numbers are used in all the drawing FIGs. to relate to the sameelements. The embodiments have been numbered first embodiment, secondembodiment, etc. as a matter of descriptive convenience and are notintended to have any other significance or provide limitations for thepresent invention.

For expository purposes, the term “horizontal” as used herein is definedas a plane parallel to the plane or surface of the memory layer,regardless of its orientation. The term “vertical” refers to a directionperpendicular to the horizontal as just defined. Terms, such as “above”,“below”, “bottom”, “top”, “side” (as in “sidewall”), “higher”, “lower”,“upper”, “over”, and “under”, are defined with respect to the horizontalplane, as shown in the figures. The term “on” means that there is directcontact between elements. The term “directly on” means that there isdirect contact between one element and another element without anintervening element.

The term “active side” refers to a side of a die, a module, a package,or an electronic structure having active circuitry fabricated thereon orhaving elements for connection to the active circuitry within the die,the module, the package, or the electronic structure.

The term “processing” as used herein includes deposition of material orphotoresist, patterning, exposure, development, etching, cleaning,and/or removal of the material or photoresist as required in forming adescribed structure.

Referring now to FIG. 1, therein is shown an architectural diagram of aconductive bridge memory system 100 in an embodiment of the presentinvention. The architectural diagram of the conductive bridge memorysystem 100 depicts a single memory cell having a transistor 102 coupledto a bottom electrode 106 in contact with a memory layer 104. It isunderstood that an array of memory cells together can form theconductive bridge memory system 100.

The bottom electrode 106 can be formed in and on a dielectric layer 108,such as a silicon nitride (SiN) layer or a silicon dioxide (SiO₂) layer,by a combination of masking, etching, and deposition. The bottomelectrode 106 can be a metal structure formed of metals or alloysincluding platinum (Pt), titanium nitride (TiN), Ruthenium (Ru),tungsten (W), sulfur (S), tungsten nitride (WN), or a combinationthereof The bottom electrode 106 can be deposited by physical vapordeposition (PVD), chemical vapor deposition (CVD), sputtering, plating,or metal layer deposition in an opening that was etched in thedielectric layer 108.

The memory layer 104 includes an ionic source layer 112 on a resistancechange layer 110 on the bottom electrode 106. The resistance changelayer 110 can be formed by a deposition of a suitable insulatingmaterial or a semiconductor material such as a rare-earth oxide, arare-earth nitride, a silicon oxide, or a silicon nitride, orspecifically, such as gadolinium oxide (Gd₂O₃), aluminum oxide (Al₂O₃),or silicon oxide (Si₂O₃) on the bottom electrode 106, for example. Theresistance change layer 110 is defined as an insulative layer which, incombination with the ionic source layer 112, can be switched between ahigh or low resistance state depending on a direction of an electricfield (polarity of voltage) generated between an upper electrode 114 andthe bottom electrode 106.

The ionic source layer 112 is defined as the source of ions for forminga conductive bridge between the upper electrode 114 and the bottomelectrode 106, thereby reducing the resistance between the twoelectrodes. The ionic source layer 112 can be formed of a dopedchalcogenide, or layers of alloys of Tellurium (Te), known as Telluride,and transition or main group metals, such as Copper telluride(CuTe_(x)), Aluminum telluride (Al₂Te_(x)), Zinc telluride (ZnTe_(x)),Nickel telluride (Ni₂Te_(x)), Zirconium telluride (ZrTe_(x)), and Silvertelluride (Ag₂Te_(x)) in various configurations, for example. Thecombination of the resistance change layer 110 and the ionic sourcelayer 112 can form the memory layer 104. The memory layer 104 can bemanipulated, during operation, to reflect a low resistance state or ahigh resistance state by inducing the flow of ions from the ionic sourcelayer 112 through the resistance change layer 110. The ionic sourcelayer 112 can be from 50 to 1000 angstroms, with a thickness of 150 to300 angstroms being the preferred thickness.

The upper electrode 114 can be formed on the top surface of the ionicsource layer 112. The upper electrode 114 can be formed of an interfacelayer 116 deposited directly on the ionic source layer 112 and a caplayer 118 on the interface layer 116. The interface layer 116 can beformed by deposition of transition metals including titanium (Ti),silicon (Si), zirconium (Zr), or alloys, but it is understood that thematerial chosen for the interface layer 116 cannot be too reactive withthe ionic source layer 112. For example, materials such as Silver (Ag)and Copper (Cu) can be completely consumed by the ionic source layer 112when heated to the process temperature range of 200-450 degrees Celsius.

The cap layer 118 can be formed of low resistance metals or alloysincluding; Tungsten (W), Tungsten Nitride (WN), Titanium (Ti), andTitanium Nitride (TiN). The cap layer 118 can be formed of multiplelayers of metals or alloys, which are chemically isolated from the ionicsource layer 112. The multiple layers of the cap layer 118 can alsoinclude layers of Copper (Cu), Aluminum (Al), Tantalum (Ta), or alloysthereof. It is understood that other combinations of metal or alloys canbe deposited on the interface layer 116 in single or multiple layers inorder to form the cap layer 118 having a thickness in the range of 2-30nm.

A voltage reference interconnect 120 can be coupled to the upperelectrode 114 for providing the operational voltage required to operatethe conductive bridge memory system 100. The memory cell shown in thisview can be formed using a damascene process to form a confined memorycell.

Referring now to FIG. 2, therein is shown a detailed view of a portionof the memory layer 104. In this detailed view is shown an example ofthe various layers of the ionic source layer 112 of the memory layer 104in a hole of the dielectric layer 108 of FIG. 1. For example, thevarious layers of the ionic source layer 112 can form an aluminum copperzirconium telluride film (AlCuZrTe film). The ionic source layer 112 mayalso contain other elements such as oxygen (O), germanium (Ge), silicon(Si), or nitrogen (N). The ionic source layer 112 may also contain otherchalcogens. The wavy lines on the sides of the figure indicate that onlya portion of each layer is shown.

The ionic source layer 112 can have a reactivation layer 212R (layer R),a first ion source layer 212A (layer A), and a second ion source layer212B (layer B). The reactivation layer 212R, such as aluminum telluride(AlTe), the first ion source layer 212A, such as an early transitionmetal combined with Te such as zirconium telluride (ZrTe), and thesecond ion source layer 212B, such as a late transition metal combinedwith Tc such as copper telluride (CuTe), can be deposited on theresistance change layer through a process such as chemical vapordeposition (CVD) or atomic layer deposition (ALD). The reactivationlayer 212R can also be tellurium combined with an early main group metalother than Al.

The layers can be arranged in various ways. For example, the layers canbe arranged on the resistance change layer 110 in a four-layerconfiguration such as ARBR, from top to bottom. Alternatively, theconfiguration can be of the form BRAR. In the BRAR configuration, thereactivation layer 212R can be directly on the resistance change layer110, with the first ion source layer 212A on top of the reactivationlayer 212R, followed by another of the reactivation layer 212R on thefirst ion source layer 212A, and the second ion source layer 212B on theanother of the reactivation layer 212R. In this example, the four-layerconfiguration can be, from top to bottom, a CuTe layer on top of an AITelayer on top of a ZrTe layer on top of another AlTe layer.

For illustrative purposes, a four-layer configuration is described, butit is understood that other layering configurations are possible, aslong as there is an AlTe layer between each alternating CuTe and ZrTelayer. For example, 6 or more alternating layers can be in aconfiguration such as ARBRAR. Further, Cu could be replaced with anappropriate late transition metal, and Zr could be replaced by anappropriate early transition metal.

Referring now to FIG. 3, therein is shown a cross-sectional view of aportion of the memory layer 104 in a deposition phase of manufacture.The dielectric layer 108 of FIG. 1 can be masked with a pattern forcreating confined memory cells and etched to form holes in thedielectric layer 108. The resistance change layer 110 can be depositedfirst into a hole in the dielectric layer 108. The reactivation layer212R can be deposited in the hole via a CVD or ALD process on top of theresistance change layer 110. An exemplary CVD process for depositing thereactivation layer 212R as AITe is shown in Table 1 below:

TABLE 1 susecptor temperature 350 C. carrier gas flow rate 100 sccmpressure 5 torr Al precusor trisdimethylamido aluminum (TDMAA) Tereaction gas di-tert-butyltelluride (DTBTe) process steps TDMAA 2 secondpulse, 5 second purge DTBTe 1 second pulse, 5 second purge

AITe is deposited via the above process in a layer that can be between 5and 50 angstroms thick. Other deposition processes such as physicalvapor deposition, or sputtering, cannot be controlled precisely enoughto deposit at these thicknesses.

Referring now to FIG. 4, therein is shown the structure of FIG. 3 in afurther deposition phase of manufacture. The first ion source layer 212Acan be deposited, also in the hole in the dielectric layer 108 of FIG.1, on top of the reactivation layer 212R through a process such as CVDor ALD. The reactivation layer 212R is on top of the resistance changelayer 110. An exemplary CVD process for depositing the first ion sourcelayer 212A as ZrTe on top of AITe is shown in Table 2 below:

TABLE 2 susecptor temperature 350 C. carrier gas flow rate 100 sccmpressure 5 torr Zr precusor tetrakis(dimethylamino)zirconium (TDMAZ) Tereaction gas DTBTe process steps TDMAZ 2 second pulse, 5 second purgeDTBTe 1 second pulse, 5 second purge

ZrTe is deposited via the above process in a layer that can be between 5and 50 angstroms thick. The Zr precursor is shown as TDMAZ though it isunderstood that any suitable precursor of the general chemical formulaZr(NR₂)₄ can be used. Other deposition processes such as physical vapordeposition, or sputtering, cannot be deposited in the desired structureor thicknesses.

Referring now to FIG. 5, therein is shown the structure of FIG. 4 in afurther deposition phase of manufacture. Another of the reactivationlayer 212R can be deposited, also in the hole in the dielectric layer108 of FIG. 1, via a CVD or ALD process on top of the first ion sourcelayer 212A. An exemplary CVD process for depositing the reactivationlayer 212R as AlTe on top of ZrTe is shown in Table 1 above.

AITe is deposited via the above process in a layer that can be between 5and 50 angstroms thick. Other deposition processes such as physicalvapor deposition, or sputtering, cannot be deposited in the desiredstructures or thicknesses.

Following the deposition of the second of the reactivation layer 212R,the formation of the ionic source layer 112 of FIG. 1 on the resistancechange layer 110 can be completed by deposition of the second ion sourcelayer 212B, also in the hole in the dielectric layer 108 of FIG. 1, ontop of the second of the reactivation layer 212R via a process such as aCVD or ALD process. An exemplary CVD process for depositing the secondion source layer 212B as CuTc on top of AITe is shown in Table 3 below:

TABLE 3 susecptor temperature 350 C. carrier gas flow rate 100 sccmpressure 5 torr Cu precusor copper(n,n′-diisopropyl-2-dimetylamine-amidinate) (Cu(DMAPA)) Te reaction gas DTBTe process steps Cu(DMAPA) 4second pulse, 5 second purge DTBTe 1 second pulse, 5 second purge

CuTc is deposited via the above process in a layer that can be between 5and 50 angstroms thick. Other deposition processes such as physicalvapor deposition, or sputtering, cannot be controlled precisely enoughto deposit at these thicknesses. Following the deposition of the secondion source layer 212B, the surface can be planarized using a processsuch as chemical mechanical planarization/polishing (CMP), completing adamascene process to form the memory layer 104 of FIG. 1. The upperelectrode 114 of FIG. 1 can then be formed on top of the memory layer104.

It has been discovered that layering ZrTe and CuTe using AlTe as anintermediate layer (the first ion source layer 212A and the second ionsource layer 212B layered with the reactivation layer 212R as anintermediate layer) can allow the creation of aluminum copper zirconiumtelluride films in spite of being unable to cause CuTe to nucleatedirectly on ZrTe via CVD. Extensive testing with Cu(DMAPA), CuKI₅, andcopper pivalate as precursors found that none would nucleate on a ZrTesurface. Attempts to nucleate on Zr or Te alone were unsuccessful. TheZrTe surface could not be reactivated via surface treatment using NH₃,H₂, alcohols, water, or formic acid either. However, it was found thatAlTe would nucleate on ZrTe and reactivate the surface, allowing CuTe tonucleate on a previously inert surface. X-ray photoelectron spectrometrywas used to confirm deposition and ensure atomic percentages were withinappropriate ranges. Preferred ranges of atomic percentages for Cu, Al,Zr, and Te are from 5 to 95%.

The reactivation layer 212R (AlTe) reactivating ZrTe was an unexpecteddiscovery because the aluminum precursor (Trisdimethylamido aluminum, orAl(N(CH₃)₂)₃) is comprised of the same ligands as the Zr precursor(Tetrakis(dimethylamino)zirconium, or Zr(N(CH₃)₂)₄), and the samereaction gas of di-tert-butyl telluride was used during the CVD process.It is expected that similar ligands should exhibit similar surfacetermination chemistry, and therefore it is unexpected that Cu or CuTeapplied via CVD would exhibit significant reactivity differences betweenZrTe and AITe.

It has also been discovered that forming a confined memory cell via adamascene process having the ionic source layer 112 formed of a AlCuZrTefilm with the first ion source layer 212A and the second ion sourcelayer 212B with the reactivation layer 212R between them, all depositedin holes in the dielectric layer 108, at a specific thickness, cannot bedone using a standard PVD technique but can be performed using CVD orALD. Because sputtering or PVD cannot achieve the memory cell dimensions(with the first ion source layer 212A, the second ion source layer 212B,and the reactivation layer 212R being from 5 to 50 angstroms inthickness and in a confined memory cell) desired, CVD or ALD ispreferred, and the reactivation of the first ion source layer 212A bythe reactivation layer 212R is necessary to ensure proper deposition ofthe second ion source layer 212B.

Thus, it has been discovered that the conductive bridge memory systemmethod of manufacture thereof of the present invention furnishesimportant and heretofore unknown and unavailable solutions,capabilities, and functional aspects for manufacturing memory layerscontaining AlCuZrTe films as the ionic source layer.

Referring now to FIG. 6, therein is shown a flow chart of a method 600of manufacture of a conductive bridge memory system in a furtherembodiment of the present invention. The method 600 includes: providinga dielectric layer having a hole on a bottom electrode, the hole overthe bottom electrode in a block 602; forming an ionic source layer inthe hole and over the bottom electrode including: depositing areactivation layer over the bottom electrode, depositing a first ionsource layer on the reactivation layer, depositing another of thereactivation layer on the first ion source layer, and depositing asecond ion source layer on the another of the reactivation layer in ablock 604; and forming an upper electrode on the ionic source layer in ablock 606.

The resulting method, process, apparatus, device, product, and/or systemis straightforward, cost-effective, uncomplicated, highly versatile andeffective, can be surprisingly and unobviously implemented by adaptingknown technologies, and are thus readily suited for efficiently andeconomically manufacturing conductive bridge memory systems/fullycompatible with conventional manufacturing methods or processes andtechnologies.

Another important aspect of the present invention is that it valuablysupports and services the historical trend of reducing costs,simplifying systems, and increasing performance.

These and other valuable aspects of the present invention consequentlyfurther the state of the technology to at least the next level.

While the invention has been described in conjunction with a specificbest mode, it is to be understood that many alternatives, modifications,and variations will be apparent to those skilled in the art in light ofthe aforegoing description. Accordingly, it is intended to embrace allsuch alternatives, modifications, and variations that fall within thescope of the included claims. All matters hithertofore set forth hereinor shown in the accompanying drawings are to be interpreted in anillustrative and non-limiting sense.

1-20. (canceled)
 21. A memory system, comprising: a dielectric layerhaving a hole; a bottom electrode, wherein the bottom electrode isformed at least one of in and on the dielectric layer, and wherein thehole of the dielectric layer is over the bottom electrode; an ionicsource layer in the hole and over the bottom electrode, the ionic sourcelayer including: a reactivation layer over the bottom electrode, a firstion source layer on the reactivation layer, another of the reactivationlayer on the first ion source layer, a second ion source layer on theanother of the reactivation layer; and an upper electrode on the ionicsource layer.
 22. The system as claimed in claim 21, further comprising:a resistance change layer in the hole and on the bottom electrode. 23.The system as claimed in claim 21, wherein the first ion source layerincludes: an early transition metal; and a chalcogen.
 24. The system asclaimed in claim 21, wherein the second ion source layer includes: alate transition metal; and a chalcogen.
 25. The system as claimed inclaim 21, wherein the reactivation layer includes: an early main groupmetal; and a chalcogen.
 26. The system as claimed in claim 21, furthercomprising: a resistance change layer in the hole and on the bottomelectrode, wherein: the reactivation layer includes an early main groupmetal and a chalcogen; the first ion source layer includes an earlytransition metal and a chalcogen; and the second ion source layerincludes a late transition metal and a chalcogen.
 27. The system asclaimed in claim 26, further comprising: a transistor connected to thebottom electrode.
 28. The system as claimed in claim 26, wherein thefirst ion source layer includes: zirconium; and tellurium.
 29. Thesystem as claimed in claim 26, wherein the second ion source layerincludes: copper; and tellurium.
 30. The system as claimed in claim 26,wherein the reactivation layer includes: aluminum; and tellurium.
 31. Amemory system, comprising: a dielectric layer having a hole; a bottomelectrode, wherein the hole of the dielectric layer is over the bottomelectrode; a resistance change layer in the hole and on the bottomelectrode; an ionic source layer in the hole and on the resistancechange layer, the ionic source layer including: a reactivation layer,having aluminum telluride, on the resistance change layer, a first ionsource layer, having zirconium telluride, on the reactivation layer,another of the reactivation layer on the first ion source layer, asecond ion source layer, having copper telluride, on the another of thereactivation layer; and an upper electrode on the ionic source layer.32. The system as claimed in claim 31, wherein the ionic source layerincludes materials deposited by chemical vapor deposition or atomiclayer deposition.
 33. The system as claimed in claim 31, wherein thefirst ion source layer having zirconium telluride includes a zirconiumprecursor having the general chemical formula of Zr(NR₂)₄.
 34. Thesystem as claimed in claim 31, wherein the second ion source layerhaving copper telluride includes a reactivated surface of the first ionsource layer having zirconium telluride, and.
 35. The system as claimedin claim 31, wherein the surface of the first ion source layer isactivated with a reactivation layer having aluminum telluride.
 36. Aconductive bridge memory system, comprising: a bottom electrode; adielectric layer having a hole over the bottom electrode; an ionicsource layer in the hole and over the bottom electrode, the ionic sourcelayer including: a reactivation layer over the bottom electrode, a firstion source layer on the reactivation layer, another reactivation layeron the first ion source layer, a second ion source layer on the anotherreactivation layer; and an upper electrode on the ionic source layer.37. The system as claimed in claim 36, further comprising: a resistancechange layer in the hole and on the bottom electrode.
 38. The system asclaimed in claim 36, wherein the first ion source layer includeszirconium telluride.
 39. The system as claimed in claim 36, wherein thesecond ion source layer includes copper telluride.
 40. The system asclaimed in claim 36, wherein the reactivation layer includes aluminumtelluride.